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DATA SHEET
MOS INTEGRATED CIRCUIT
PD121A10
2-POWER SUPPLY INPUT METHOD 1.0 V/2.0 A REGULATOR
DESCRIPTION
PD121A10 is the CMOS regulator which can output 2.0 A current. This regulator is suitable for power supply for 1.0 V ASIC core, for example our companies' CB-90 (90 nm process LSI) etc. The dropout voltage is made small (0.7 V MAX. (IO = 1.0 A) by dividing bias voltage (VDD) from input voltage (VIN). Therefore this product can output under the conditions, VIN 1.62 V (VDD 4.0 V). Output voltage can be adjustable between 0.95 and 1.15 V.
FEATURES
* Output Current: 2.0 A * Output Voltage: 0.95 to 1.15 V * Bias Voltage: 4.0 to 5.5 V * Reference Voltage Tolerance: VREF 10 mV (TJ = 25C) * Low Dropout Voltage: VDIF = 0.7 V MAX. (IO = 1.0 A) * On-chip over-current protection circuit * On-chip thermal shut down circuit
PIN CONFIGURATION (Marking Side)
5-PIN TO-252 (5-PIN MP-3ZK)
6
1. INPUT 2. VDD (ON/OFF) 3. GND
Note
12345
4. SENSE 5. OUTPUT 6. GND (Fin)
APPLICATIONS
This regulator is suitable for low power supply voltage IC, for example core of CB-90 (90 nm process LSI) etc.
Note No.3 pin is cut and can not be connected to substrate. No.6 is Fin and common to GND pin.
BLOCK DIAGRAM
VDD INPUT - Buffer Reference + voltage Over-current protection OUTPUT
Constant current
+ Error amp. -
SENSE Thermal shut down Triming
GND
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. G18843EJ1V0DS00 (1st edition) Date Published July 2007 NS Printed in Japan
2007
PD121A10
ORDERING INFORMATION
Part Number Package 5-PIN TO-252 (5-PIN MP-3ZK) Reference Voltage 0.6 V Output Voltage 0.95 to 1.15 V Marking 121A10
PD121A10T1F
Remark Since it is the tape-packaged product, "-E1" or "-E2" is added to the end of its product name.
Part Number
Note
Package 5-PIN TO-252 (5-PIN MP-3ZK)
Package Type * 16 mm wide embossed taping * Pin 1 on draw-out side * 2,500 pcs/reel
PD121A10T1F-E1-AT
PD121A10T1F-E2-AT
5-PIN TO-252 (5-PIN MP-3ZK)
* 16 mm wide embossed taping * Pin 1 at take-up side * 2,500 pcs/reel
Note Pb-free (This product does not contain Pb in the external electrode and other parts.)
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Input Voltage Bias Voltage Internal Power Dissipation (TC = 25C) Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to ambient) Thermal Resistance (junction to case)
Note
Symbol VIN VDD PT TA TJ Tstg Rth(J-A) Rth(J-C)
Rating -0.3 to +6.0 -0.3 to +6.0 10 -20 to +85 -20 to +150 -55 to +150 125 12.5
Unit V V W C C C C/W C/W
Note Internally limited. When the operating junction temperature rises above 150C, the internal circuit shuts down the output voltage. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded.
TYPICAL CONNECTION
VDD D1
INPUT
INPUT
PD121A10
OUTPUT OUTPUT R1 D2 SENSE R2
GND
CIN GND
COUT
+
2
Data Sheet G18843EJ1V0DS
PD121A10
CIN : 0.1 F or higher. Be sure to connect CIN to prevent parasitic oscillation. Set this value according to the length of the line between the regulator and the INPUT pin. Use of a film capacitor or other capacitor with first-rate voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 F or higher for the voltage and temperature range to be used. COUT : 10 F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 1 to 2 cm). Use the capacitor whose capacitance value is 10 F or more under use conditions. D1 D2 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. VOUT = (1 + R1/R2) VREF
Note
R1, R2: The total amount of R1 and R2 is sure to below 200 k (100 k TYP.).
Note When VOUT = 1 V: R1 = 40 k, R2 = 60 k Caution1. Make sure that no external voltage is applied to the OUTPUT pin. 2. VDD pins (Bias voltage) must be supplied in a separate power supply from that of INPUT pins (Input voltage).
RECOMMENDED OPERATING CONDITIONS
Parameter Input Voltage (VO = 1.0 V) Output Voltage Bias Voltage Output Current Operating Ambient Temperature Operating Junction Temperature Symbol VIN VO VDD IO TA TJ MIN. 1.62
Note
TYP. 2.0 1.0 5.0
MAX. 2.65 1.15 5.5 2.0 + 85 + 125
Unit V V V A C C
0.95 4.0 0 - 20 - 20
Note It needs 1.7 V VIN 2.65 V to output IO = 2.0 A. Caution1. Power on VIN first, and then VDD on start-up. When the power is turned off, turn off VDD first. Note that the voltage of VDD must not be kept 3.0 V or less. 2. If absolute maximum rating is not exceeded, you can used this product above the recommended operating range. However, since a margin with absolute maximum rating decreases, please use this product after sufficient evaluation.
Data Sheet G18843EJ1V0DS
3
PD121A10
ELECTRICAL CHARACTERISTICS
(TJ = 25C, VIN = 2.0 V, VDD = 5.0 V, IO = 1.0 A, VO = 1.0 V, CIN = 0.1 F, COUT = 10 F, unless otherwise specified)
Parameter Reference Voltage (SENSE pin) Line Regulation Load Regulation Quiescent Current Symbol VREF1 VREF2 REGIN REGL IBIAS1 IBIAS2 Quiescent Current Change Conditions - -20C TJ +125C 1.7 V VIN 2.65 V 0 A IO 2.0 A IO = 0 A IO = 2.0 A 4.0 V VDD 5.5 V, IO = 0 A 0 A IO 2.0 A 10 Hz f 100 kHz f = 1 kHz, 1.8 V VIN 2.2 V IO = 1.0 A VO = 0 V 4.0 V VDD 5.5 V IO = 0 A, 0C TJ 125C - - IO = 0 A IO = 2.0 A IO = 0 A, VDD = 0 V MIN. 0.59 (0.58) - - - - - - - - - - 2.0 - 4.0 - - - - TYP. 0.6 - 1 1 125 300 12 100 230 56 0.17 3.0 - 0.14 - - IBIAS1 IBIAS2 - MAX. 0.61 (0.62) 15 15 500 1000 300 500 - - 0.7 - - - - 0.5 - - 1 Unit V V mV mV
A A A A Vr.m.s.
dB V A A mV/C V V
IBIAS1 IBIAS2
Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage ON-state Voltage (VDD) OFF-state Voltage (VDD) ON-state Bias Pin (VDD Pin) Current OFF-state Bias Pin (VDD Pin) Note Current
Vn R*R VDIF IOshort IOpeak
VO/T
VDD(ON) VDD(OFF) IBIAS(ON1) IBIAS(ON2) IBIAS(OFF)
A A A
Note Standby Current Remark Values in parentheses are product design values, and are thus provided as reference values.
4
Data Sheet G18843EJ1V0DS
PD121A10
TYPICAL CHARACTERISTICS
PD vs. TA
VREF vs.TJ VREF - Reference Voltage Temperature
10.0 VIN = 2.0 V VDD = 5.0 V IO = 1.0 A
20
PD - Power Dissipation - W
15
5.0
ite
hea
tsin
k
Change - mV
10
Wi
th i
nfin
0
5 1.0 0 0
-5.0
Without heatsink
50 85 100 150
-10.0 -20
0
25
50
75
100
125
TA - Operating Ambient Temperature - C
TJ - Operating Junction Temperature - C
VO vs. VDD
1.2 200
IBIAS vs. VDD
IBIAS - Quiescent Current - A
1.0
VO - Output Voltage - V
150 IO = 0 A 0.1 A 1.0 A
0.8 0.6 0.4 0.2 0 0 1.0 2.0
IO = 0 A 0.1 A 1.0 A
100
50 TJ = 25C VIN = 2.0 V 0 0 1.0 2.0 3.0 4.0 5.0 6.0
TJ = 25C V IN = 2.0 V
3.0 4.0 5.0 6.0
VDD - Bias Voltage - V
VDD - Bias Voltage - V
VDIF vs. TJ
R * R vs. f
80 70
0.3
R * R - Ripple Rejection - dB
VDIF - Dropout Voltage - V
0.25 0.2 0.15 0.1 0.05 0 -20
IO = 0 A
60 50 40 30 20 10 0 TJ = 25C VIN = 1.8 to 2.2 V VDD = 5.0 V CIN = 0.1 F COUT = 10 F 1.0 A 2.0 A
VDD = 5.0 V IO = 1.0 A 0 25 50 75 100 125
10
100
1k
10 k
100 k
TJ - Operating Junction Temperature - C
f - Frequency - Hz
Data Sheet G18843EJ1V0DS
5
PD121A10
VDD(ON) vs. TJ
VDD(OFF) vs. TJ
4.0
VDD(OFF) - OFF-state Voltage - V VDD(ON) - ON-state Voltage - V
1.5
3.0
1.0
2.0
0.5
1.0 VIN = 2.0 V 0 -20 0 25 50 75 100 125
VIN = 2.0 V 0 -20 0 25 50 75 100 125
TJ - Operating Junction Temperature - C VO vs. IO
TJ - Operating Junction Temperature - C
1.25 1.0 0.75 0.50 0.25 0 0 1.0 2.0 3.0
TJ = 25C VIN = 2.0 V VDD = 5.0 V
VO - Output Voltage - V
4.0
5.0
IO - Output Current - A
6
Data Sheet G18843EJ1V0DS
PD121A10
PACKAGE DRAWING (Unit: mm)
5-PIN TO-252 (MP-3ZK)
E b1 E1 6 L1 A c1
D1 D H
1
2
3
4
5 A1
L2 c b
SEATING PLANE GAUGE PLANE
x4 e
L
c2
(UNIT:mm) ITEM D D1 E E1 H A DIMENSIONS 6.10 0.20 4.4TYP(4.0MIN) 6.500.20 4.4TYP(4.3MIN) 9.8TYP(10.3MAX) 2.300.10 0 to 0.25 0.600.10 5.0 0.500.10 0.500.10 0.508 1.14 1.520.12 1.0 0.80 P5T1F-114-1
NOTE 1.
No Plating area
A1 b b1 c c1 c2 e L L1 L2
2006
Data Sheet G18843EJ1V0DS
7
PD121A10
RECOMMENDED MOUNTING CONDITIONS
The PD121A10 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
PD121A10T1F-AT
Process Infrared reflow
Note
: 5-PIN TO-252 (5-PIN MP-3ZK)
Conditions Package peak temperature: 260C, Time: 60 seconds MAX. (at 220C or higher), Count: Three times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Symbol IR60-00-3
Partial Heating Method
Pin temperature: 350C or below, Heat time: 3 seconds or less (per each side of the device).
P350
Note Pb-free (This product does not contain Pb in the external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress.
REFERENCE DOCUMENTS
USER'S MANUAL USAGE OF THREE TERMINAL REGULATORS INFORMATION VOLTAGE REGULATOR OF SMD SEMICONDUCTOR DEVICE MOUNT MANUAL Document No.G12702E Document No.G11872E http://www.necel.com/pkg/en/mount/index.html
8
Data Sheet G18843EJ1V0DS
PD121A10
NOTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device.
Data Sheet G18843EJ1V0DS
9
PD121A10
* The information in this document is current as of July, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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